Recent Advances in Precision Diamond Wire Sawing Monocrystalline Silicon

نویسندگان

چکیده

Due to the brittleness of silicon, use a diamond wire cut silicon wafers is critical stage in solar cell manufacturing. In order improve production yield cutting process, it necessary have thorough understanding phenomena relating parameters. This research reviews and summarizes technology for precision machining monocrystalline using sawing (DWS). Firstly, mathematical models, molecular dynamics (MD), finite element method (FEM), other methods used studying principle DWS are compared. Secondly, equipment reviewed, influences direction magnitude force on material removal rate (MRR) analyzed, improvement wafer surface quality through optimizing process parameters summarized. Thirdly, principles processing performances three assisted methods, namely ultrasonic vibration-assisted (UV-DWS), electrical discharge (ED-DWS), electrochemical-assisted (EC-DWS), reviewed separately. Finally, prospects provided, highlighting its significant potential future development improvement.

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ژورنال

عنوان ژورنال: Micromachines

سال: 2023

ISSN: ['2072-666X']

DOI: https://doi.org/10.3390/mi14081512